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外形尺寸:14.2mm*13.4mm*1.5mm
參數配置:MICRO-SIM:Push-pull
1.MATERIAL Insulator:High Temperature Thermoplastic UL94V-O Contact:Copper Alloy Shell:Copper Alloy
2.PLATING Contact Area:Gold PLATED Over Ni. Solder Tail:Sn PLATED Over Ni. Shell Solder Arda:Gold PLATED Over Ni.
3.ELECTRICAL Operating Temperature:-25℃ TO+90℃ Current Rating:0.5mA max. Contact Resistance:100mΩ max. Insulation Resistance:1000MΩ min./500VDC