深圳市腾飞讯电子科技有限公司

外形尺寸：14.2mm*13.4mm*1.5mm  

 參數配置：MICRO-SIM:Push-pull 

  1.MATERIAL Insulator:High Temperature Thermoplastic 　　UL94V-O 　　Contact:Copper Alloy 　　Shell:Copper Alloy 

  2.PLATING Contact Area:Gold PLATED Over Ni. 　　Solder Tail:Sn PLATED Over Ni. 　　Shell Solder Arda:Gold PLATED Over Ni.

 3.ELECTRICAL 　　Operating  Temperature:-25℃ TO+90℃ 　　Current Rating:0.5mA max. 　　Contact Resistance:100mΩ max. 　　Insulation Resistance:1000MΩ min./500VDC